Cleaning |
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1.special
are shall be taken when applying the chemicals listed below for cleaning because certain
chemicals may damage the surface of lens or case and cause discoloration. |
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Solvent |
Adaptability |
Ethyl alcohol, Isopropyl alcohol |
o |
Trichloroethylene,Chlorothene
Acetone, Thinner |
x |
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2.Dipping
time:2minutes max. at normal temperature |
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Forming |
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1.The
lead frame should be bent at a point 2mm away from the body resin. |
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2.Bending
should be performed with the base firmly Fixed by means of a jig or radio pliers. |
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3.
Lead forming should be performed prior to soldering. |
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4.Avoid
applying any stress to resin in order to prevent the epoxy fracture and break on bonding
wire. |
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5.Avoid
Forming the lead Frame at the same point twice or more. |
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Soldering |
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1.Be
sure not to mount LEDs in conditions where excessive stress is applied to lead frames. |
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2.The
mounting direction of the flat package type LED electrodes is perpendicular to the
direction of the board curve. |
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3.JIAMING
will not guarantee LEDs mounted directly on the board because the resin bodies may be
damaged by the applied force from board-warping, lead-cutting or clinching when being
soldered.(It is strongly recommended that this should be carried out after very careful
preparation.) |
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4.Care
should be taken to avoid any shock or vibration to the LED resin body after it has been
soldered until the temper-ature of the LED has returned to normal. |
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5.Conditions
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Types |
Soldering iron |
Dip soldering |
Reflow soldering |
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Temperature at tip of iron:
300¡æmax .(300 w max.)
Soldering time:
3 sec. max.
Location:
At least 3 mm away from resin body |
Pre-heating:
100¡æ max. (Resin surface temperature) 60 sec. Max.
Bath temperature: 260+/-5¡æ
(small package:240+/-5¡æ)
Dipping time: 5 sec. Max.
Location:
At least 3.0 mm away from resin body |
Not
recommended |
Alphanumeric displays |
![b13.jpg (8192 bytes)](b13.jpg)
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![b14.jpg (8492 bytes)](b14.jpg) |
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Temperature at tip of iron:
300¡æ max(300 w max.)
Soldering time:
3 sec. Max.
Location:
At least 3 mm away from body resin |
Pre-heating:
80¡æ max. (Resin surface temperature) 60 sec. Max.
Bath temperature: 260+/-5¡æ
(small package: 240+/-5¡æ)
Dipping time: 5 sec. max.
Location:
At least 2.6 mm away from resin body |
Not
recommended |
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